Socket for semiconductor device

ABSTRACT

The cap body of the pressing cap has lamellar pieces for pressing portions of the substrate in the contact sheet, in which ends of the respective sides of the bare chip are positioned.

This application claims priority from Japanese Patent Application No.2002-200459 filed Jul. 9, 2002 and 2003-004977 filed Jan. 10, 2003,which are incorporated hereinto by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a socket for a semiconductor device,having a contact sheet.

2. Description of the Related Art

A semiconductor device mounted for an electronic equipment or others hasbeen subjected to various tests prior to being mounted to the latter sothat latent defects are removed. Such tests are carried out in anon-destructive manner including tests in which a voltage stress isapplied thereto, or it is operated or stocked in a high temperatureenvironment in correspondence to the thermal and mechanicalenvironmental tests or the like. Of these various tests, a burn-in testin which the operation test is carried out in a high-temperaturecondition for a predetermined period is particularly effective forremoving integrated circuits causing infant mortality failures.

A test jig used for this burn-in test is generally called as an ICsocket. As disclosed in a specification of Japanese Patent ApplicationNo. 2002-200459 and Japanese Patent Application Laid-open No. 9-017539(1997), in a test for KGD (Known Good Die) which is a non-defective barechip passing the preceding test, it is advanced a suggestion that such abare chip is accommodated in an accommodation portion of the IC socketby a carrier detachably mounted thereto.

As shown, for example, in FIG. 20, the carrier unit is comprised of acarrier housing 2 having a accommodation portion 2A for accommodating abare chip 12, a contact sheet 6 located on the inner bottom wall of theaccommodation portion 2A in the carrier housing 2 via an elastic sheet4, a pressing cap 14 for pressing an electrode group in the bare chip 12onto a bump group 6B of the contact sheet 6, and a latch mechanism 10for selectively holding the pressing cap 14 relative to the carrierhousing 2.

The contact sheet 6 has the bump group including a plurality of bumps 6Bformed of copper or others opposed to the electrode group in the barechip 12 to be electrically connected, as shown in FIG. 20. In FIG. 20,two bumps 6B of which are illustrated in an exaggerated manner asrepresentative thereof. The plurality of bumps 6B are arranged in aframe shape in correspondence to the electrode group. A tip end of therespective bump projects from a surface of the contact sheet 6 by apredetermined height level. In this regard, in FIG. 21, of which twobumps 6B are shown as representative of the group thereof for thepurpose of simplifying the drawing.

The pressing cap 14 is comprised of a pressing body 16 having a pressingsurface to be brought into contact with a surface facing a surface ofthe bare chip 12 on which the electrode group are formed, a cap body 20accommodating a base portion of the pressing body 16, and a plurality ofsprings 18 disposed in a space between the base portion of the pressingbody 16 and the inner surface of a recess in the cap body 20, forbiasing the pressing body 16 toward the bare chip 12.

The base portion of the pressing body 16 has hooks on the outerperiphery thereof and inserted into the recess of the cap body 20 in amovable manner. The cap body 20 has step height 20N on the outersurfaces at opposite ends thereof, with which tip ends of hook members10FA and 10FB of the latch mechanism 10 are engaged, as shown in FIG.20.

The latch mechanism 10 is comprised of the hook members 10FA and 10FBsupported rotational moveably by the carrier housing 2 to be engageablewith the step height 20N of the cap body 20 in the pressing cap 14, andhelical torsion springs (not shown) for biasing the hook members 10FAand 10FB in the direction that they are engaged with the step height 20Nof the cap body 20.

Accordingly, when the pressing cap 14 is located over the bare chip 12positioned in advance relative to the bumps 6B of the contact sheet 6,as shown in FIG. 21, the tip ends of the hook members 10FA and 10FB ofthe latch mechanism 10 are made to rotate by the edge of the step heightof the cap body 20 of the pressing cap 14 to be away from each other sothat the pressing body 16 of the pressing cap 14 is accommodated in theaccommodation portion 2A.

When the pressing cap 14 is mounted to the interior of the accommodationportion 2A in the carrier housing 2, the outer periphery of the pressingbody 20 is guided by a guiding member 8 provided in the carrier housing2. Thereafter, by being biased by the helical torsion spring, tip endsof the hook members 10FA and 10FB of the latch mechanism 10 is made torotate in the mutually approaching direction as shown in FIG. 20 andengaged with the upper surfaces of the step height 20N of the cap body20. As a result, the pressing cap 14 is held by the carrier housing 2.

Since the respective bump 6B as described above is formed withdiameter-to-height ratios of 1:1, if the diameter becomes smaller incorrespondence to the high-density arrangement of the electrode group inthe bare chip 12, the height of the bump 6B is also lower.

Accordingly, when a region in the vicinity of the bump group opposed tothe elastic sheet 4 in the contact sheet 6 sinks against the elasticityof the elastic sheet 4 as shown in FIG. 22 in an partially enlargedmanner, there is a risk in that the outer peripheral edge of the barechip 12 is brought into contact with a copper conductor layer 6C formedon the surface of the contact sheet 6 and may be damaged thereby, asshown in FIG. 21. Also, there is a risk in that a contact pressure ofthe bump group of the contact sheet 6 with the electrode group of thebare chip 12 is lower than a predetermined value.

FIG. 23 illustrates another example of the conventional carrier unit.The carrier unit shown in FIG. 23 is comprised of a carrier housing 2′having an accommodation portion 2A′ for accommodating a bare chip 12′, acontact sheet 6′ disposed on the inner bottom of the accommodationportion 2A′ of the carrier housing 2′ via an elastic sheet 4′, apressing cap 14′ for pressing the electrode group in the bare chip 12′onto the bump group of the contact sheet 6′, and a latch mechanism 10′for selectively holding the pressing cap 14′ on the carrier housing 2′.

The contact sheet 6′ has a plurality of bumps 6 b′ made of copper orothers and opposed to the electrode group in the bare chip 12′ to beelectrically connected thereto. In this regard, in FIG. 23, of which twobumps 6 b′ are shown in an exaggerated manner as representative. A tipend of the respective bump 6 b′ projects from the surface of the contactsheet 6 by a predetermined height.

The pressing cap 14′ is comprised of a pressing body 16′ having apressing surface to be brought into contact with a surface of the barechip 12′ opposite to the surface of the bare chip 12′ on which theelectrode group are formed, a cap body 20′ for accommodating a baseportion of the pressing body 16′ and a plurality of springs 18′ disposedin a space between the base portion of the pressing body 16′ and theinside surface of the cap body 20′, for biasing the pressing body 16′toward the bare chip 12′.

The base portion of the pressing body 16′ is inserted into a recess ofthe cap body 20′ in a movable manner, and has hooks on the outerperiphery thereof.

The cap body 20′ has projections at opposite ends thereof to be engagedwith hook members 10′ of the latch mechanism.

The latch mechanism includes hook members 10′ supported rotationalmoveably by the carrier housing 2′ to be engageable with the projectionsof the cap body 20′ in the pressing cap 14′, and helical torsion springsfor biasing the hook members 10′ in the direction that they engage withthe projections of the cap body 20′.

Accordingly, when the pressing cap 14′ is located over the bare chip 12′positioned in advance relative to the bumps 6 b′ in the contact sheet6′, tip ends of the hook members 10′ of the latch mechanism are made torotate by the slanted surface of the projection of the cap body 20′ inthe pressing cap 14′ in the mutually parting direction, whereby thepressing body 16′ of the pressing cap 14′ is accommodated. When thepressing cap 14′ is mounted into the accommodation portion 2A′ of thecarrier housing 2′, the outer periphery of the cap body 20′ is guided byguide members 8′ provided at the carrier housing 2′. Thereafter, by thebiasing force of the helical torsion springs, the tip ends of the hookmembers of the latch mechanism 10′ are made to rotate in the mutuallyapproaching direction and engage with the upper surface of theprojection of the cap body 20′. As a result, the pressing cap 14′ isheld by the carrier housing 2′.

The carrier unit, the bumps 6 b′ in the contact sheet 6′ or others arepreferably durable against the repeated use of several times.Particularly, by the repeated use, a contact area between the tip end ofthe bump 6 b′ in the contact sheet 6′ and the electrode of the bare chip12′ will be liable to be gradually larger because the bare chip 12′ ispressed at a predetermined pressure.

As described above, the cap body 20′ of the pressing cap 14′ is mountedto the accommodation portion in the carrier housing 2′ while beingguided by the guide member 8′ provided in the carrier housing 2′.However, since a gap is actually formed between the outer periphery ofthe carrier housing 2′ and the guide member 8′, the tip ends of thebumps 6 b′ are pressed by a deviated pressure generated on the chip 12′by the pressing cap 14′ inclined toward one side.

Accordingly, the distribution of heights and contact areas or the likeof the plurality of bumps 6′ is varied to exceed the allowable value,whereby there is a risk in that the electric connection the tip ends ofa portion among the bumps 6 b′ with the electrodes of the bare chip 12′becomes unreliable.

SUMMARY OF THE INVENTION

In view of the above problems in the prior art, a first object of thepresent invention is to provide a socket for a semiconductor devicecomprising a contact sheet, capable of restricting the contact of a barechip with the contact sheet caused by the sinking of the contact sheetin the vicinity of a bump group accompanied with the high-densityarrangement of a electrode group in the bare chip.

A second object of the present invention is to provide a socket for asemiconductor device capable of avoiding the inconvenience in that theundesirable deviated pressure is applied to part of a plurality of bumpsin the contact sheet.

In a first aspect of the present invention, there is provided a socketfor a semiconductor device comprising: a contact sheet having aplurality of bumps to be electrically connected to a terminal group of asemiconductor device, for inputting/outputting signals relative to thesemiconductor device, a pressing member for pressing terminals of thesemiconductor device onto the bumps of the contact sheet, anaccommodation portion for accommodating the semiconductor devicedisposed on the contact sheet, and a movement-amount controlling memberfor controlling a movement amount of the semiconductor device along thedirection of a projected height of the bump when the pressing memberdisposed in the accommodation portion is in a pressed state.

In a second aspect of the present invention, there is provided a socketfor a semiconductor device comprising: a contact sheet having a bumpgroup to be electrically connected to a terminal group of asemiconductor device, for inputting/outputting signals relative to thesemiconductor device, a pressing member for pressing terminals of thesemiconductor device onto a bump group of the contact sheet, and acontact sheet pressing member for pressing the contact sheet in thedirection in which the sinking of the contact sheet in the vicinity ofthe bump group is restricted when the terminals of the semiconductordevice are pressed onto the bump group by the pressing member.

In a third aspect of the present invention, there is provided a socketfor a semiconductor device comprising: a contact sheet having aplurality of bumps to be electrically connected to a terminal group of asemiconductor device, for inputting/outputting signals relative to thesemiconductor device, a pressing member for pressing terminals of thesemiconductor device onto the bumps of the contact sheet, anaccommodation portion for accommodating the semiconductor devicedisposed on the contact sheet, and a movement-amount restricting memberfor restricting a movement amount of the semiconductor device along thedirection of a projected height of the bump when the pressing memberdisposed in the accommodation portion is in a pressed state.

As apparent from the above description, according to the socket for asemiconductor device according to the present invention, since thecontact sheet pressing member is provided for pressing the contact sheetin the direction for suppressing the sinking of an area on the peripheryof the bump group in the contact sheet when the terminals of thesemiconductor device are pressed onto the bump group, it is possible torestrict the contact of the bare chip with the contact sheet due to thesinking of the area in the contact sheet in the vicinity of the bumpgroup accompanied with the high-density arrangement of the terminalgroup in the bare chip.

Also, according to the socket for a semiconductor device according tothe present invention, since an amount of the movement of thesemiconductor device in the height direction of the bump is restrictedwhen the pressing member disposed in the accommodation portion is in apressed state, it is possible to avoid the application of theundesirable deviated pressure to part of the plurality of bumps in thecontact sheet.

The above and other objects, effects, features and advantages of thepresent invention will become more apparent from the followingdescription of embodiments thereof taken in conjunction with theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a structural drawing showing a configuration in a firstembodiment of a carrier unit used in an example of a socket for asemiconductor device according to the present invention;

FIG. 2 is a structural drawing showing a configuration of a pressing capin the carrier unit shown in FIG. 1;

FIG. 3 is a plan view of the embodiment shown in FIG. 2;

FIG. 4 is an enlarged partially sectional view of an important part ofthe embodiment shown in FIG. 1;

FIG. 5 is a plan view of a contact sheet in the embodiment shown in FIG.1;

FIG. 6 is a structural drawing schematically showing an overallstructure in the embodiment of the socket for a semiconductor deviceaccording to the present invention;

FIG. 7 is an exploded structural drawing schematically showing anoverall structure in the embodiment shown in FIG. 6;

FIG. 8 is a structural drawing showing a configuration in a secondembodiment of a carrier unit used for the socket for a semiconductordevice according to the present invention;

FIG. 9 is a structural drawing made available for explaining theoperation of the embodiment shown in FIG. 8;

FIG. 10 is a plan view of a contact sheet in the embodiment shown inFIG. 8;

FIG. 11 is a structural drawing showing a configuration in a thirdembodiment of a carrier unit used for the socket for a semiconductordevice according to the present invention;

FIG. 12 is a structural drawing made available for explaining theoperation of the embodiment shown in FIG. 11;

FIG. 13 is a plan view of a base member in the embodiment shown in FIG.11;

FIG. 14 is a partially sectional view showing an important part in afourth embodiment of a carrier unit used for the socket for asemiconductor device according to the present invention;

FIG. 15 is a plan view of the embodiment shown in FIG. 14;

FIG. 16 is a partially sectional view made available for explaining theoperation of the embodiment shown in FIG. 14;

FIG. 17 is a partially sectional view of the carrier unit of the fourthembodiment used for the socket for a semiconductor device according tothe present invention, with the carrier unit removed from the body ofthe IC socket;

FIGS. 18A and 18B are partially sectional views, respectively,schematically showing an important part of a carrier unit in a fifthembodiment of the carrier unit used for the socket for a semiconductordevice according to the present invention;

FIG. 19 is a partially sectional view schematically showing a importantpart of a sixth embodiment of the a carrier unit used for the socket fora semiconductor device according to the present invention;

FIG. 20 is a structural drawing showing a configuration of a carrierunit used for the conventional socket for a semiconductor device;

FIG. 21 is a structural drawing made available for explaining theoperation of the embodiment shown in FIG. 20;

FIG. 22 is an enlarged partially sectional view of part of the contactsheet shown in FIG. 20; and

FIG. 23 is a partially sectional view showing structure of theconventional socket for a semiconductor device.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

FIG. 6 illustrates one embodiment of the socket for a semiconductordevice according to the present invention.

In the socket for a semiconductor device shown in FIG. 6 is comprised ofa carrier unit 40 for accommodating a bare chip 60 therein as asemiconductor device, and an IC socket 30 to which is detachably mountedthe carrier unit 40.

The IC socket 30 is mainly comprised of a body section 32 disposed on aprinted wiring board 38 for inputting test signals to the bare chip 60and outputting detected output signals from the bare chip 60, having anaccommodation portion for accommodating the carrier unit 40, a contactgroup 34 consisting of a plurality of contacts to be electricallyconnected to pads, respectively, on a contact sheet 44 described later,and a cover member 36 disposed to be movable upward/downward relative tothe body section 32 so that the respective contact sections in thecontact group 34 are selectively electrically connected to therespective pads of the contact sheet.

The body section 32 molded of resinous material is disposed at apredetermined position in correspondence to the electrode portion of theprinted wiring board 38. The body section 32 has an accommodationportion 32A for accommodating the carrier unit 40 therein as shown inFIG. 7. The accommodation portion 32A is surroundedly defined by theinner periphery of a lower base portion 32 a to be engaged to a lowerportion of a base of the carrier unit 40 described later and the innerperiphery of an upper base portion 32 b contiguous to the lower baseportion 32 a to be engaged to an upper portion of the base. The contactgroup 34 are held by the lower base portion 32 a. Slits are formed inthe lower base portion 32 a and the upper base portion 32 b at apredetermined pitch in the vertical direction relative to a papersurface so that the respective contacts 34 ai (wherein i=1 to n, n is apositive integer) in the contact group 34 are inserted therein. Thecontact group 34 are provided on each side while encircling theaccommodation portion 32A. In this regard, in FIGS. 6 and 7, only onegroup among the four contact groups 34 encircling four sides of theaccommodation portion 32A are illustrated.

The respective contact 34 ai (wherein i=1 to n, n is a positive integer)is comprised of a terminal section 34T press-fit into the lower baseportion 32 a, a fixed contact section 34 f contiguous to the terminalsection 34T and electrically connected to a pad 44P of the contact sheet44 described later from below, an elastic movable contact section 34 mcontiguous to the terminal section 34T and electrically connected to thepad 44P from above, and a portion being engaged 34 e bifurcated from themovable contact section 34 m and selectively engageable with a slant ofa cover member 36 described later to rotate the movable contact section34 m to be away from the fixed contact section 34 f.

The contacts 34 ai are arranged at a predetermined pitch incorrespondence to the pads 44P of the contact sheet 44 described laterin the direction generally vertical to the paper surface, respectively.The cover member 36 molded of resinous material has an opening 36 athrough which the carrier unit 40 passes. A frame portion defining theperiphery of the opening 36 a is supported by legs guided by groovesprovided on the outer periphery of the body section 32 to be movableupward and downward. In this regard, the cover member 36 is biased byelastic members (not shown) to be away from the body section 32. At alower end of the respective side of the frame portion, a slant section36 s is formed, respectively. When the cover member 36 is lowered to apredetermined position as shown by a chain double-dashed line in FIG. 6,the slant section 36 s is engaged with the portion being engaged 34 e ofthe contact 34 ai as above to rotate the movable contact section 34 magainst the elasticity thereof to be away from the fixed contact section34 f.

When the carrier unit 40 described later is mounted to the body section32 of the IC socket 30, the cover member 36 is pushed down by a givendistance and maintained there so that the respective movable contactsections 34 m in the contact group 34 are moved to a waiting positionaway from the accommodation portion 32A, then the carrier unit 40 isinserted and positioned in the accommodation portion 32A from abovethrough the opening 36 a. At this time, the fixed contact section 34 fis brought into contact with the lower surface of the pad 44P of thecontact sheet 44 in the carrier unit 40.

Subsequently, when the cover member 36 is released from the retentionstate, the cover member 36 is moved upwardly due to a resultant force ofthe above recovery force of the elastic body and the elastic force ofthe portion being engaged 34 e of each contact 34 ai. At this time, therespective movable contact section 34 m in the contact group 34 returnsto the original position and is brought into contact with the uppersurface of the pad 44P of the contact sheet 44 in the carrier unit 40.Thereby, as shown in FIG. 6, the contact sheet 44 is electricallyconnected to the four contact groups 34.

As shown in FIG. 7, the carrier unit 40 in the first embodiment iscomprised of a carrier housing 46 having an accommodation portion 46Afor accommodating the bare chip 60, the contact sheet 44 disposed on thebase member 42 defining a bottom of the accommodation portion 46A of thecarrier housing 46 via an elastic sheet 58 made of the rubber material,a pressing cap 52 including a pressing body for pressing the electrodegroup of the bare chip 60 onto the bump group 44B of the contact sheet44, and a latch mechanism 50 for selectively holding the pressing cap 52on the carrier housing 46.

The latch mechanism 50 is comprised of hook members 48A and 48Bsupported rotational moveably at opposite ends of the carrier housing46, for holding a cap body of the pressing cap 52, helical torsionsprings 66 for biasing the hook members 48A and 48B in the directionshown by an arrow in FIG. 7, that is, in the direction that engages themwith projections of the cap body, and pins 68 for supporting the hookmembers 48A and 48B and the helical torsion springs 66.

At each of the opposite ends of the carrier housing 46, a guide section46 g is formed for guiding an outer periphery of a lower portion of thecap body 64 when the pressing cap 52 is mounted. On the periphery of theguide section 46 g, opposite ends of the pin 68 is supported.

The contact sheet 44 has a plurality of bumps 44B in a substrate 44arranged in correspondence to the electrode group of the bare chip 60 tobe electrically connected thereto, as schematically illustrated in anpartially enlarged manner in FIG. 1. In this regard, in FIG. 1, two inthe plurality of bumps 44B are shown in an exaggerated manner asrepresentatives. For example, the bump 44B made of copper or others hasa diameter of approximately 100 μm at a root thereof and projects fromthe surface of the substrate 44M by a predetermined height, for example,of approximately 50 μm. The substrate 44M is made, for example, ofpolyimide resin as thin as about several tens μm.

The respective bump 44B is connected to the respective pad 44 p via aconductor layer 44 c made of copper foil. As shown in FIG. 6, theplurality of pads 44 p are formed in opposite end portions of thesubstrate 44M extended outward from the opposite ends of the base member42.

The pressing cap 52 is comprised of, as shown in FIGS. 1 and 2, apressing body 56 having a pressing surface 56 a to be brought intocontact with the upper surface of the bare chip 60, a cap body 64 foraccommodating a base portion of the pressing body 56, and a plurality ofsprings 54 disposed in a space between recesses 56 r in the base portionof the pressing body 56 and recesses 64 r in the cap body 64, forbiasing the pressing body 56 toward the bare chip 60. In this regard,FIG. 2 illustrates the pressing cap 52 in a pressed state.

The bare chip 60 of a generally square shape has the electrode group onthe lower surface opposed to the bumps in the contact sheet 44.

The cap body 64 has projections 64 p on the outer periphery thereof, asshown in FIG. 1, to be engaged with the hook members 48A and 48B,respectively, in the latch mechanism 50.

In a recess of the cap body 64, to which the recesses 64 r open,lamellar pieces 64 t are formed integral with the cap body 64 at aplurality positions as contact sheet pressing members. The lamellarpiece 64 t having a predetermined thickness is provided, for example, atfour positions in correspondence to the respective sides of the barechip 60 to intersect the base portion of the pressing body 56 in thegenerally vertical direction thereto as shown in FIG. 5. The respectivelamellar piece 64 t is provided to define a predetermined gap CL betweenthe same and the end of the respective side of the bare chip 60, forexample, in a range from approximately 0.1 mm to 1 mm. Also, a projectedlength of the lamellar piece 64 t is determined such that the surface ofthe substrate 44M of the contact sheet 44 sinks to a depth correspondingto the height of the bump 44B as shown in FIG. 4 in an enlarge mannerwhen the lamellar piece 64 t passes through the slit 56 s in the baseportion of the pressing body 56 and presses the substrate 44M of thecontact sheet 44 as shown in FIG. 1.

The base portion of the pressing body 56 is inserted in the recess inthe cap body 64 in a movable manner. At an end of a portion of thepressing body 56 inserted into the recess, a plurality of hooks 56 nengageable with hooks 64 n provided at a lower end of the cap body 64are formed. Thereby, the pressing body 56 is held in the interior of thecap body 64 while being biased with the springs 54, for example.

In such a structure, when the bare chip 60 is mounted into the carrierunit 40, the electrode group of the bare chip 60 are first positioned tothe bumps 44B in the contact sheet 44 so that the electrode group of thebare chip 60 are brought into contact with the bumps 44B.

Then, the pressing cap 52 is inserted into the accommodation portion 46Aof the carrier housing 46. At this time, tip ends of the hook members48A and 48B of the latch mechanism 50 are made to rotate in thedirection away from each other against the biasing force of the helicaltorsion springs 66. Also, the pressing surface 56 a of the pressing body56 is pressed onto the upper surface of the bare chip 60 against thebiasing force of the springs 54, while the outer peripheral surface ofthe cap body 64 is guided by the inner surface of the guide section 46g.

At this time, as shown in FIGS. 1 and 4, the portion close to an endportion of the respective side of the bare chip 60 on the substrate 44Mof the contact sheet 44 is pressed by one end of the lamellar piece 64,and sinks. Accordingly, it is possible to avoid the interference betweenthe conductor layer 44 c formed on the surface of the substrate 44M inthe contact sheet 44 and the end portion of the bare chip 60.

Subsequently, due to the biasing force of the helical torsion springs66, the tip ends of the hook members 48 are made rotate in the mutuallyapproaching direction and engaged with the projections 64 p of the capbody 64. As a result, as shown in FIG. 1, the pressing cap 52 is held bythe carrier housing 46.

FIG. 8 illustrates a second embodiment of a carrier unit used for thesocket for a semiconductor device according to the present invention. InFIG. 8, the same reference numerals are used for denoting the sameconstituent elements in the embodiment shown in FIG. 1 and theexplanation thereof will be eliminated.

The carrier unit shown in FIG. 8 is comprised of a carrier housing 46having an accommodation portion 46A for accommodating a bare chip 60 asshown in FIG. 1, a contact sheet 70 disposed on a base member 42defining a bottom of the accommodation portion 46A in the carrierhousing 46 via an elastic sheet 58, a pressing cap 72 including apressing body for pressing an electrode group in the bare chip 60 onto abump group 70B in the contact sheet 70, and a latch mechanism 50 forselectively holding the pressing cap 72 in the carrier housing 46.

As shown in FIG. 9, the contact sheet 70 has a plurality of bumps 70Bdisposed in a substrate 70M in correspondence with the arrangement ofthe electrode group in the bare chip 60 to be electrically connectedthereto. In FIG. 9, two in the plurality of bumps 70B are shown asrepresentatives in the exaggerated manner. The bump 70B made, forexample, of copper has a diameter in a root portion of approximately 100μm, and is projected from the surface of the substrate 70M at apredetermined height, for example, of approximately 50 μm. The substrate70M is made, for example, of polyimide resin to be a sheet ofapproximately several tens μm thick.

The respective bump 70B is connected to the respective pad (not shown)via a conductor layer made of copper. A plurality of pads are formed inopposite end portions of the substrate 70M extended outward from theopposite ends of the base member 42.

As shown in FIG. 10, a frame-shaped convex seat 70 d having apredetermined width is provided in an area of a surface of the substrate70M opposed to the elastic sheet 58 corresponding to the arrangement ofthe bumps 70B, as a sinking-adjustment area for adjusting an amount ofsinking of the respective bump 70B. The seat 70 d is made, for example,of resin, metal or resist to have a predetermined height. As shown inFIG. 9, a height thereof is determined so that a predetermined gap S isformed between the surface of the contact sheet 70 and that of theelastic sheet 50 when no pressure is applied; that is, the height is,for example, in a range from 5 to 200 μm in accordance with the amountsof sinking of the respective bumps 70B.

As shown in FIG. 8, the pressing cap 72 is constituted by a pressingbody 78 having a pressing surface 78 a to be brought into contact withthe upper surface of the bare chip 60, a cap body 76 for accommodating abase portion of the pressing body 78, and a plurality of springs 74arranged in a space between recesses 78 r in the base portion of thepressing body 78 and recesses 76 r in the cap body 76, for biasing thepressing body 78 toward the bare chip 60. In this regard, the pressingcap 72 is in a pressed state in FIG. 8.

The cap body 76 has projections 76 p on the outer periphery thereof tobe engaged with hook members 48A and 48B, respectively as shown in FIG.8.

A base portion of the pressing body 78 is inserted in a movable mannerinto a recess of the cap body 76 to which the recesses 76 r open. At anend of a portion of the pressing body 78 inserted into the recess, aplurality of hooks 78 n are formed opposite to hooks 76 n provided at alower end of the cap body 76 so that both of them are engaged with eachother. Thereby, the pressing body 78 is held in the interior of the capbody 76 while being biased by the springs 74.

In such a structure, when the bare chip 60 is mounted to the carrierunit, first, the electrode group in the bare chip 60 are positioned tothe bumps 70B in the contact sheet 70 so that the electrode group in thebare chip 60 are brought into contact with the bumps 70B as shown inFIG. 9.

Then, the pressing cap 72 is inserted into the accommodation portion 46Ain the carrier housing 46. At this time, tip ends of the hook members48A and 48B in the latch mechanism 50 are made to rotate to be away fromeach other against the bias of the helical torsion springs. Also, thepressing surface 78 a of the pressing body 78 is pressed onto the uppersurface of the bare chip 60 against the biasing force of the springs 74,while the outer peripheral surface of the cap body 76 is guided by theinner surface of the guide sections 46 g.

At this time, the gap S formed between the surface of the contact sheet70 and that of the elastic sheet 58 is eliminated and the amount ofsinking of the substrate 70M in the contact sheet 70 in the vicinity ofthe bump 70B is restricted not to exceed the predetermined value,whereby the interference is avoidable between the conductor layer of thesubstrate 70M and the end portion of the bare chip 60.

Subsequently, the tip ends of the hook members 48A and 48B are made torotate in the mutually approaching direction due to the biasing force ofthe helical torsion springs and engaged with the projections 76 p in thecap body 76. As a result, as shown in FIG. 8, the pressing cap 72 isheld in the carrier housing 46.

FIG. 11 illustrates a third embodiment of a carrier unit used for thesocket for a semiconductor device according to the present invention. InFIG. 11, the same reference numerals are used for denoting the sameconstituent elements in the embodiment shown in FIG. 8 and theexplanation thereof will be eliminated.

The carrier unit shown in FIG. 11 is constituted by a carrier housing 46having an accommodation portion 46A for accommodating a bare chip 60 asshown in FIG. 8, a contact sheet 78 disposed on a base member 82defining a bottom of the accommodation portion 46A in the carrierhousing 46 via an elastic sheet 58, a pressing cap 72 including apressing body for pressing an electrode group in the bare chip 60 onto abump group 80B in the contact sheet 70, and a latch mechanism 50 forselectively holding the pressing cap 72 in the carrier housing 46.

As shown in FIG. 11, the contact sheet 80 has a plurality of bumps 80Bdisposed in a substrate 80M in correspondence with the arrangement ofthe electrode group in the bare chip 60 to be electrically connectedthereto. In FIG. 9, two in the plurality of bumps 80B are shown asrepresentatives in the exaggerated manner. The bump 80B made, forexample, of copper has a diameter in a root portion of approximately 100μm, and is projected from the surface of the substrate 80M at apredetermined height, for example, of approximately 50 μm. The substrate80M is made, for example, of polyimide resin to be a sheet ofapproximately several tens μm thick.

The respective bump 80B is connected to the respective pad (not shown)via a conductor layer made of copper. A plurality of pads are formed inopposite end portions of the substrate 80M extended outward from theopposite ends of the base member 82.

As shown in FIG. 12, in a portion of the base member 82 in which theelastic sheet 58 is disposed and corresponding to the arrangement of thebumps 80B in the substrate 80M, a convex seat 82 d in a frame shapehaving a predetermined width is formed as a sinking-adjustment sectionfor adjusting an amount of sinking of the respective bump 80B. The seat82 d is made, for example, of the same material as that of the basemember 82. The height thereof is determined such that when no pressureis applied, a predetermined gap S is formed between the surface of thecontact sheet 80 and the surface of the elastic sheet 58, in a rangefrom 5 to 200 μm in accordance with the amount of sinking of therespective bump 80B. In this regard, the seat 82 d may be formedseparately from the base member 82.

In the above structure, when the bare chip 60 is mounted to the carrierunit, first, the electrode group in the bare chip 60 are positioned incorrespondence to the bumps 80B in the contact sheet 80, as shown inFIG. 12, so that the electrode group in the bare chip 60 are broughtinto contact with the bumps 80B, respectively.

Next, the pressing cap 72 is inserted into the accommodation portion 46Aof the carrier housing 46. At this time, tip ends of the hook members48A and 48B in the latch mechanism 50 are made to rotate to be away fromeach other against the biasing force of the helical torsion springs.Also, while the outer peripheral surface of the cap body 76 is guided bythe inner surfaces of the guide sections 46 g, the pressing surface 78 aof the pressing body 78 is pressed onto the upper surface of the barechip 60 against the biasing force of the springs 74.

At this time, the predetermined gap S between the surface of the contactsheet 80 and that of the elastic sheet 58 is eliminated and the amountof sinking solely in the vicinity of the bumps 80B in the substrate 80Mof the contact sheet 80 is restricted not to exceed the predeterminedvalue, whereby the interference is avoidable between the conductor layerof the substrate 80M and the end portion of the bare chip 60.

Subsequently, tip ends of the hook members 48A and 48B are made torotate to be closer to each other and engaged with the projections 76 pof the cap body 76, respectively. As a result, the pressing cap 72 isheld in the carrier housing 46.

FIG. 17 illustrates, together with a socket for a semiconductor device,an important part of a fourth embodiment of a carrier unit used for thesocket for a semiconductor device according to the present invention.

In FIG. 17, the same reference numerals are used for denoting the sameconstituent elements as in the embodiment shown in FIG. 7, and theexplanation thereof will be eliminated.

The socket for a semiconductor device shown in FIG. 17 is comprised of acarrier unit 140 for accommodating a bare chip as a semiconductor devicein the interior thereof, and an IC socket 30 for mounting the carrierunit 140 in an accommodation portion thereof in a detachable manner.

As shown in FIG. 17, the carrier unit 140 is comprised of a carrierhousing 146 having an accommodation portion 146A for accommodating abare chip 160, a contact sheet 144 disposed on a base member 142defining the bottom of the accommodation portion 146A in the carrierhousing 146 via an elastic sheet 158, a pressing cap 152 including apressing body 156 for pressing an electrode group of the bare chip 160onto a bump group 144B in the contact sheet 144, and a latch mechanism150 for selectively holding the pressing cap 152 in the carrier housing146.

As shown in FIG. 14, the pressing cap 152 is comprised of a pressingbody 156 having a pressing surface 156 a to be brought into contact withthe upper surface of the bare chip 160, a cap body 164 for accommodatinga base portion of the pressing body 156, and a plurality of springs 154arranged in a space between recesses in the base portion of the pressingbody 156 and recesses in the cap body 164, respectively, for biasing thepressing body 156 toward the bare chip 160.

The bare chip 160 of a generally square shape has an electrode group,for example, on a lower surface confronting the bumps 144B of thecontact sheet 144.

The base portion of the pressing body 156 is inserted into a recess inthe cap body 164 in a movable manner. At an end of the inserted portionof the pressing body 156, a plurality of hooks 156 n are formed to beengageable with hooks provided at a lower end of the cap body 164, bothof which hooks are opposite to each other. Thereby, the pressing body156 is held in the cap body 164 while being biased by the springs 154.

The cap body 164 is provided at opposite ends thereof with projections164P to be engaged with the hook members 148A and 148B in the latchmechanism 150. The projection 164P has a slant 164PS engageable with aslant at a tip end portion of the hook member 148A, 148B to push thelatter away from each other when the pressing cap 152 is mounted asdescribed later.

The latch mechanism 150 is comprised of the hook members 148A and 148Bsupported rotational moveably at opposite ends of the carrier housing146 to hold the cap body 164, helical torsion springs 166 for biasingthe hook members 148A and 148B in the direction shown by an arrow inFIG. 17 so that they are engaged with the projections 164 p in the capbody 164, and pins 168 for supporting the hook members 148A, 148B andthe helical torsion springs 166.

At the opposite ends of the carrier housing 146, the guide sections 146g are formed for guiding the outer periphery of the lower portion of thecap body 164 when the pressing body 152 is mounted.

Opposite ends of the pin 168 are supported by guide sections 146 g.

As shown in FIGS. 14 and 15, the contact sheet 144 has a plurality ofbumps 144B in a substrate 144M, arranged in correspondence to theelectrode group of the bare chip 160 to be electrically connectedthereto. In FIG. 14, two in the plurality of bumps 144B are shown asrepresentatives in the exaggerated manner. For example, the respectivebump 144B made of copper or others has a diameter of approximately 100μm at a tip end thereof and a predetermined height from the surface ofthe substrate 144M, for example, of approximately 50 μm. The substrate144M is made of polyimide resin as thin as approximately several tensμm.

As shown in FIG. 15, the respective bump 144B is connected to the pad144P via the conductor layer 144C made of copper foil. The pads 144P areformed in the opposite end portions of the substrate 144M extendedoutward from the opposite ends of the base member 142.

Also, as shown in FIGS. 14 and 15, in portions on the substrate 144Mcorresponding to four corners of the bare chip 160, dummy bumps 162 areprovided, respectively, as a moving amount restriction member. The dummybump 162 is made, for example, of metal such as palladium (Pd), platinum(Pt), cobalt (Co), iron (Fe), Nickel (Ni), ruthenium (Ru), rhodium (Rh),osmium (Os), iridium (Ir), hassium (Hs), meinerium (Mt) or Unununium(Uun), or alloys mainly composed thereof.

When the dummy bump 162 is formed, as disclosed in Japanese PatentApplication Laid-open No. 11-326379 (1999), first, a tip end of a wiremade of the above metal is wire-bonded to a pad formed in advance on thesubstrate 144M by a ultrasonic welding. Then, the bonded tip end portionof the wire is torn. Thereby, a stud bump is formed on the substrate144M. Finally, the upper end of the stud bump thus formed is flattenedwith a forming tool to complete the dummy bump 162 on the substrate144M.

A height of the dummy bump 162 from the surface is determined to beequal to or slightly lower than the height of the bump 144B from thesurface, for example.

In this regard, a region in which the dummy bump 162 is positioned isnot limited to that shown in this embodiment, but may be a region havingno pads or wires, or that in which pads or wire meshes are coated, withan insulation coating. Also, material and the number of dummy bumps 162are not limited to those shown in this embodiment, but other suitablematerial may be selected, of course, such as solder used for the bumps144B, having no risk of being crushed while exceeding a predeterminedvalue even if each dummy bumps are subjected to a total load applied toall the bumps 144B with the assumption that a load is applied to thebumps 144B under a pressure of about 10 g per a bump. In this structure,when the bare chip 160 is mounted into the carrier unit 140, theelectrode group in the bare chip 160 are positioned to the bumps 144B inthe contact sheet 144 so that the electrode group in the bare chip 160are brought into contact with the bumps 144B, respectively. Then, thepressing cap 152 is inserted into the accommodation portion 146A of thecarrier housing 146. At this time, by the slants 164 ps of the cap body164 in the pressing cap 152, tip ends of the hook members 148A and 148Bare made to rotate to be away from each other against the bias of thehelical torsion springs 166. Also, while the outer peripheral surface ofthe cap body 156 is guided by the inner surface of the guide sections146 g, the pressing surface 156 a of the pressing body 156 is pressedonto the upper surface of the bare chip 160 against the bias of thesprings 154.

Subsequently, the tip ends of the hook members 148 are made to rotate tobe closer to each other due to the bias of the helical torsion springs166, and engaged with the projections 164 p of the cap body 164. As aresult, the pressing cap 152 is held by the carrier housing 146.

At this time, since a predetermined gap actually exists between theouter peripheral surface of the cap body 164 and the inner surface ofthe guide section 146 g, there is a risk in that the pressing surface156 a of the pressing body 156 presses the bare chip 160 and the bumps144B in an inclined posture as shown in FIG. 16.

However, in such a case, since the dummy bump 162 is provided in thevicinity of the bump 144B, part of the bare chip 160 may interfere withthe tip end of the bump 144B to restrict a mount of pressing such as forexample a movement distance of the bare chip 160 in the height directionof the bump 144B or a contact area of the tip end of the bump 144B withthe electrode surface of the bare chip 160. As a result, the deviatedcrush of the plurality of bumps 144B is avoidable.

FIGS. 18A and 18B schematically illustrate a fifth embodiment of acarrier unit used for the socket for a semiconductor device according tothe present invention. In this regard, in FIGS. 18A and 18B, the samereference numerals are used for denoting the same constituent elementsas in the embodiment shown in FIG. 14, and the explanation thereof willbe eliminated.

While the dummy bump 162 in the contact sheet 144 shown in FIG. 14 ismade of relatively rigid material free from a risk of crush, in theembodiment shown in FIGS. 18A and 18B, four dummy bumps 172 made ofelastic material such as silicone rubber are provided in a contact sheet170.

The contact sheet 170 has a plurality of bumps 170B, in a substrate170M, arranged in correspondence to the electrode group in the bare chip160 electrically connected thereto. For example, the respective bump170B made of solder or others has a diameter at a tip end thereof ofapproximately 100 μm, and a height from the surface of the substrate170M of approximately 50 μm. The substrate 170M is made, for example, ofpolyimide resin to be a sheet of approximately several tens μm thick.

Not illustrated, the respective bump 170B is connected to a pad via aconductor layer made of copper foil. The pads are formed in the oppositeend portions of the substrate 170M extended outward from the oppositeends of the base member 142.

The dummy bumps 172 used as a moving amount restriction member areprojected from the substrate 170M at positions corresponding to fourcorners of the bare chip 160. The lowermost end of the dummy bump 172 isfixed to the base member 142 and the upper end thereof is projectedoutward through small holes 170 a and 158 a in the substrate 170M of thecontact sheet 170 and the elastic body 158, respectively. As shown inFIG. 18A, when the biasing force of the coil springs 154 is not applied,the projected height of the dummy bump 172 is determined to be slightlyhigher than that of the bump 170B. In addition, as shown in FIG. 18B,when the biasing force of the coil springs 154 is applied, the projectedheight of the dummy bump 172 is determined to be equal to or slightlylower than that of the bump 170B.

Also in this embodiment, a region in which the dummy bump 162 ispositioned is not limited to that shown in this embodiment, but may be aregion having no pads or wires, or that in which pads or wire meshes arecoated with an insulation coating. Also, material and the number ofdummy bumps 172 are not limited to those shown in this embodiment, butother suitable material may be selected, of course, such as solder usedfor the bumps 170B, having no risk of being crushed while exceeding apredetermined value even if each dummy bumps are subjected to a totalload applied to all the bumps 170B with the assumption that a load isapplied to the bumps 170B under a pressure of about 10 g per a bump.

In this structure, when the pressing cap 152 is mounted to the carrierhousing 46, there is a risk in that the pressing surface of the pressingbody 156 presses the bare chip 160 and the bumps 170B in an inclinedposture.

In such a case, however, since the dummy dump 172 is provided in thevicinity of the bump 170B, part of the slanted bare chip 160 is broughtinto contact with a tip end of the dummy dump 172 and presses the same.At this time, a pushed amount of the bare chip 160 is restricted to apredetermined value due to the repulsion of the dummy bump 172.

Further, FIG. 19 schematically illustrates a sixth embodiment of acarrier unit used for the socket for a semiconductor device according tothe present invention. In this regard, in FIG. 19, the same referencenumerals are used for denoting the same constituent elements as in theembodiment shown in FIG. 14, and the explanation thereof will beeliminated.

In the preceding embodiment, the dummy bump 162 in the contact sheet 144directly restricts the amount of movement of the bare chip 160 by thecontact of the upper end of the dummy bump 172 with a surface of thebare chip 160 opposite to the bump 144B. In FIG. 19, however, dummybumps 180 are provided at four positions in the contact sheet 144′ forrestricting the movement of the pressing body 156 for the purpose ofindirectly restricting an amount of the movement of the bare chip 160.The respective dummy bump 180 is provided in a region directly opposedto the pressing surface 156 a of the pressing body 156 while avoidingthe interference with the bare chip 160.

A projected height of the dummy bump 180 as a moving amount restrictionmember from the surface of the substrate 144M′ is determined such that adistance between the electrode surface of the bare chip 160 and thesurface of the substrate 144M′ is equal to or slightly lower than theprojected height of the bump 144B when the pressing cap 52 is insertedinto the accommodation portion 146A of the carrier housing 146 and heldthere.

The dummy bump 180 is made of the same material as that of the precedingdummy bump 162 and formed in the same manner as described with referenceto FIG. 14.

Accordingly, in this embodiment, the same operation and effect areobtainable as in the preceding embodiment.

In this regard, while the present invention is applied a system in whichthe carrier unit is mounted to the body section 32 of the IC socket 30in the preceding embodiments, the present invention should not belimited to this, but may be applied to other systems as a contact sheetitself, of course.

The present invention has been described in detail with respect topreferred embodiments, and it will now be apparent from the foregoing tothose skilled in the art that changes and modifications may be madewithout departing from the invention in its broader aspects, and it isthe intention, therefore, in the appended claims to cover all suchchanges and modifications as fall within the true spirit of theinvention.

1-20. (canceled)
 21. A carrier unit for a semiconductor devicecomprising: a contact sheet having a plurality of bumps to beelectrically connected to a terminal group of a semiconductor device,for inputting/outputting signals relative to the semiconductor device; apressing member for pressing terminals of the semiconductor device ontothe bumps of the contact sheet; an accommodation portion foraccommodating the semiconductor device disposed on said contact sheet;and a movement-amount controlling member provided as part of saidcontact sheet and not electrically connectable to the terminal group,for controlling a movement amount of said semiconductor device along thedirection of a projected height of said bump when said pressing memberdisposed in said accommodation portion is in a pressed state, whereinsaid movement-amount controlling member is disposed on top of saidcontact sheet.
 22. A carrier unit for a semiconductor device comprising:a contact sheet having a bump group to be electrically connected to aterminal group of said semiconductor device, for inputting/outputtingsignals relative to said semiconductor device; a pressing member forpressing terminals of said semiconductor device onto a bump group ofsaid contact sheet; and a contact sheet pressing member for pressingsaid contact sheet in a direction of a sinking of said contact sheet inthe vicinity of said bump group is restricted when the terminals of saidsemiconductor device are pressed onto said bump group by said pressingmember, wherein said contact sheet pressing member engages the top ofthe contact sheet.
 23. A carrier unit for a semiconductor devicecomprising: a contact sheet having a bump group to be electricallyconnected to a terminal group of said semiconductor device, forinputting/outputting signals relative to said semiconductor device; apressing member for pressing said terminal group of said semiconductordevice onto a bump group of said contact sheet; and a sinking-amountadjustment section formed opposite to said bump group of said contactsheet, for compensating an amount of sinking of said bump group byapplying a force in a direction opposite to the sinking when saidterminal group of said semiconductor device is pressed by said pressingmember.
 24. A carrier unit for a semiconductor device comprising: acontact sheet having a plurality of bumps to be electrically connectedto a terminal group of a semiconductor device, for inputting/outputtingsignals relative to said semiconductor device, a pressing member forpressing terminals of said semiconductor device onto said bumps of saidcontact sheet; an accommodation portion for accommodating saidsemiconductor device disposed on said contact sheet; and amovement-amount restricting member, provided as part of said contactsheet and electrically isolated from the terminal group, for restrictinga movement amount of said semiconductor device along the direction of aprojected height of said bump when said pressing member disposed in saidaccommodation portion is in a pressed state, wherein saidmovement-amount restricting member is disposed on top of said contactsheet.
 25. A carrier unit for a semiconductor device comprising: acontact sheet having a bump group to be electrically connected to aterminal group of said semiconductor device, for inputting/outputtingsignals relative to said semiconductor device; a pressing member forpressing said terminal group of said semiconductor device onto a bumpgroup of said contact sheet; and a sinking-amount adjustment sectionformed opposite to said bump group of said contact sheet, for adjustingan amount of sinking of said bump group when said terminal group of saidsemiconductor device is pressed by said pressing member, wherein thesinking-amount adjustment section includes at least one convex seatportion formed on a surface layer of said contact sheet opposite to saidbump group.
 26. A carrier unit for a semiconductor device comprising: acontact sheet having a bump group to be electrically connected to aterminal group of said semiconductor device, for inputting/outputtingsignals relative to said semiconductor device; a pressing member forpressing said terminal group of said semiconductor device onto a bumpgroup of said contact sheet; and a sinking-amount adjustment sectionformed opposite to said bump group of said contact sheet, for adjustingan amount of sinking of said bump group when said terminal group of saidsemiconductor device is pressed by said pressing member, wherein thesinking-amount adjustment section includes at least one convex seatportion formed on a bottom of an accommodation portion for accommodatingsaid semiconductor device via said contact sheet.
 27. A carrier unit fora semiconductor device comprising: a contact sheet having a bump groupto be electrically connected to a terminal group of said semiconductordevice, for inputting/outputting signals relative to said semiconductordevice; a pressing member for pressing said terminal group of saidsemiconductor device onto a bump group of said contact sheet; and acontact sheet pressing member for pressing said contact sheet in adirection of a sinking of said contact sheet in a vicinity of said bumpgroup is restricted when the terminal group of said semiconductor deviceis pressed onto said bump group by said pressing member, wherein saidcontact sheet pressing member engages the contact sheet, and whereinsaid contact sheet pressing member is disposed in an accommodationportion for accommodating said semiconductor device and is formedintegral with said pressing member.
 28. A carrier unit for asemiconductor device comprising: a contact sheet having a bump group tobe electrically connected to a terminal group of said semiconductordevice, for inputting/outputting signals relative to said semiconductordevice; a pressing member for pressing terminals or said semiconductordevice onto said bump group of said contact sheet; and a contact sheetpressing member for pressing said contact sheet together with saidpressing member in a direction of a sinking of said contact sheet in thevicinity of said bump group is restricted and said pressing memberpresses terminals of said semiconductor device when the terminals ofsaid semiconductor device are pressed onto said bump group by saidpressing member, wherein said contact sheet pressing member engages thetop of the contact sheet.
 29. A carrier unit for a semiconductor devicecomprising: a contact sheet having a plurality of bumps to beelectrically connected to a terminal group of said semiconductor device,for inputting/outputting signals relative to said semiconductor device,a pressing member for pressing terminals of said semiconductor deviceonto said bumps of said contact sheet; an accommodation portion foraccommodating said semiconductor device disposed on said contact sheet;and a movement amount restricting member, provided as part of saidcontact sheet and electrically isolated from the terminal group, forrestricting a movement amount of said semiconductor device along adirection of a projected height of said bump when said pressing memberdisposed in said accommodation portion is in a pressed state, whereinsaid movement amount restricting member is disposed on top of saidcontact sheet and said movement amount restricting member is a dummybump engaged with said semiconductor device or said pressing member. 30.A carrier unit for a semiconductor device comprising: a contact sheethaving a plurality of bumps to be electrically connected to a terminalgroup of said semiconductor device, for inputting/outputting signalsrelative to said semiconductor device; a pressing member for pressingterminals of said semiconductor device onto said bumps of said contactsheet; an accommodation portion for accommodating said semiconductordevice disposed on said contact sheet; and a movement amount restrictingmember for restricting a movement amount of said semiconductor devicealong a direction of a projected height of said bump when said pressingmember disposed in said accommodation portion is in a pressed state,wherein said movement amount restricting member is disposed on top ofsaid contact sheet and said movement amount restricting memberinterferes with said semiconductor device or said pressing member.